Advances in Chemical Mechanical Planarization CMP

  • Author : Suryadevara Babu
  • Publsiher : Woodhead Publishing
  • Release : 24 September 2021
  • ISBN : 9780128218198
  • Page : 648 pages
  • Rating : 4/5 from 21 voters

Download or read online book entitled Advances in Chemical Mechanical Planarization CMP written by Suryadevara Babu and published by Woodhead Publishing. This book was released on 24 September 2021 with total page 648 pages. Available in PDF, EPUB and Kindle. Get best books that you want by click Get Book Button and Read as many books as you like. Book Excerpt : Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP

Advances in Chemical Mechanical Planarization CMP

Advances in Chemical Mechanical Planarization  CMP
Author: Suryadevara Babu
Publisher: Woodhead Publishing
Relase: 2021-09-24
ISBN: 9780128218198
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Relase: 2007-11-13
ISBN: 1558999515
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Relase: 2004-09
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Relase: 2016-09-21
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Relase: 2014-06-05
ISBN: 1107409195
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Publisher: Unknown
Relase: 1998
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Publisher: John Wiley & Sons
Relase: 2007-12-04
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Advances in CMP polishing Technologies for the Manufacture of Electronic Devices

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Chemical Mechanical Polishing 2001 Advances and Future Challenges

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ISBN: 1107412188
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Wafer Manufacturing Shaping of Single Crystal Silicon Wafers

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Advanced Use of the Atomic Force Microscopy in Chemical Mechanical Planarization CMP and Biophysics

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Science and Technology of Chemical Mechanical Planarization CMP

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